Call Number (LC) Title Results
E 1.99:sand--2018-1802j Poisson's Ratio of a Hyperelastic Foam Under Quasi-static and Dynamic Loading 1
E 1.99:sand--2018-1807r Deploy production sliding mesh capability with linear solver benchmarking. 1
E 1.99:sand--2018-1808r Multilinear stress-strain and failure calibrations for Ti-6Al-4V. 1
E 1.99:sand--2018-1809r Dynamic elastic-plastic response of a 2-DOF mass-spring system. 1
E 1.99:sand--2018-1810r DARPA TRADES Annual Report. 1
E 1.99:sand--2018-1815r MLEP-Fail calibration for 1/8 inch thick cast plate of 17-4 steel. 1
E 1.99:sand--2018-1843 The 2017 Nonlinear Mechanics and Dynamics Research Institute. 1
E 1.99:sand--2018-1847r Margins Associated with Loss of Assured Safety for Systems with Multiple Time-Dependent Failure Modes. 1
E 1.99:sand--2018-1848r Probability of Loss of Assured Safety in Systems with Multiple Time-Dependent Failure Modes Incorporation of Delayed Link Failure in the Presence of Aleatory Uncertainty. 1
E 1.99:sand--2018-1849r Property Values Associated with the Failure of Individual Links in a System with Multiple Weak and Strong Links. 1
E 1.99:sand--2018-1859r Return on Investment (ROI) Framework Case Study CTH. 1
E 1.99:sand--2018-1870j Mode selection and tuning of single-frequency short-cavity VECSELs 1
E 1.99:sand--2018-1873j Magnetic Nanocomposites and Their Incorporation into Higher Order Biosynthetic Functional Architectures 1
E 1.99:sand--2018-1877r Advanced Reactor Technology/Energy Conversion Project FY17 Accomplishments. 1
E 1.99:sand--2018-1889 Application of Bayesian Model Selection for Metal Yield Models using ALEGRA and Dakota 1
E 1.99:sand--2018-1890 A Generalized Framework for Modeling Next Generation 911 Implementations 1
E 1.99:sand--2018-1897j Broadband ultrafast terahertz spectroscopy in the 25 T Split Florida-Helix 1
E 1.99:sand--2018-1898 WSEAT Shock Testing Margin Assessment Using Energy Spectra Final Report 1
E 1.99:sand--2018-1900 Removal of Stationary Sinusoidal Noise from Random Vibration Signals 1
E 1.99:sand--2018-1917j Substrate thermal conductivity controls the ability to manufacture microstructures via laser-induced direct write 1