Call Number (LC) | Title | Results |
---|---|---|
TK7869 .I183 |
IEEE transactions on components, packaging, and manufacturing technology. a publication of the IEEE Components, Packaging, and Manufacturing Technology Society. IEEE transactions on components and packaging technologies : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society. |
2 |
TK7869 .I184 |
IEEE transactions on components, packaging, and manufacturing technology. a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the IEEE Lasers and Electro-Optics Society. IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro Optics Society. |
2 |
TK7869 .I32 | IEEE instrumentation & measurement magazine. | 1 |
TK7869 .I324 | Proceedings - IEEE Multi-Chip Module Conference. | 1 |
TK7869 .M38 2000 | Materials science of novel oxide-based electronics : symposium held April 24-27, 2000, in San Francisco, California, U.S.A. / | 1 |
TK7869 .M85 1999 | Multicomponent oxide films for electronics : symposium held April 6-8, 1999, San Francisco, California, U.S.A. / | 1 |
TK7870 |
Electro Static Discharge Understand, Simulate, and Fix ESD Problems. Robust electronic design reference book. The ESD control program handbook / Electronic devices and circuit fundamentals / Advances in electronic circuit packaging. Advances in electronic circuit packaging : proceedings / SmartWatch design fundamentals : WatchFace design for Samsung Galaxy SmartWatches / Electronic devices and circuit fundamentals. Prognostics and health management of electronics : fundamentals, machine learning, and internet of things / Fundamentals of electronic systems design / Flexible and stretchable medical devices / Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan / Sensors and actuators : proceedings of a conference held at the Manchester Business School 15-16 July 1996 / Electrical and electronic devices, circuits and materials : design and applications / Materials for High-Density Electronic Packaging and Interconnection. European miniature electronic components and assemblies data 1965-66. including six-language glossaries of electronic component and microelectronics terms / Guide to state-of-the-art electron devices Electronic devices, circuits, and applications / IPhone & iPad dian zi zhuan an zhi zuo : tou guo techBasic kai fa Arduino, gan ce qi yu lan ya ying yong = Building iPhone and iPad electronic projects / Wearables, smart textiles & smart apparel / Reliable design of electronic equipment : an engineering guide / Nonlinear dynamics of electronic systems : 22nd International Conference, NDES 2014, Albena, Bulgaria, July 4-6, 2014. Proceedings / High-power electronics. Electronics 2 checkbook / Electronics reliability-- calculation and design / Electronics made simple / Electronics : from theory into practice / French miniature electronic components and assemblies data, 1967-68 / Quality by design for electronics / Multisensor Fusion / Testing active and passive electronic components / Analog and digital electronics for scientists / Reliability characterisation of electrical and electronic systems / Flexible and wearable electronics for smart clothing Portable Electronics. Designing electronic product enclosures / Long-Term Non-Operating Reliability of Electronic Products. Wide Band Gap Electronic Materials / The electronics assembly handbook Make: getting started with littleBits : learning and inventing with modular electronics Make: Elektronika : od praktyki do teorii / Wearable bioelectronics ADVANCES IN SENSOR TECHNOLOGY FOR SUSTAINABLE CROP PRODUCTION |
55 |
TK7870 .A285 | ATFA-78 : advanced techniques in failure analysis : proceedings, 6-9 November 1978, Airport Marriott Hotel, Los Angeles, California, USA / | 1 |
TK7870 .A32 | Advances in microwaves. | 1 |
TK7870 A32 V.8 1974 C.2 | Advances in microwaves / | 1 |
TK7870 .A35 |
Symposium record / Advances in electronic circuit packaging. |
2 |
TK7870 .A36 | Maintainability design / | 1 |
TK7870 .A4 | Microwave circuits / | 1 |
TK7870 .A43 | American microelectronics data. | 1 |
TK7870 .A44 1964eb | American microelectronics data annual. | 1 |
TK7870 .A445 | Fundamental principles of switching circuits and systems : Communications engineering course / | 1 |
TK7870 .A46 1958a | Symposium on cleaning of electronic device components and materials / | 1 |
TK7870 .A525 | American ultraminiature component parts data. | 1 |
TK7870 .A525 1965eb | American ultraminiature component parts data, 1965-66 / | 1 |
TK7870 .A527 2004 | Electronic devices : a design approach / | 1 |