Call Number (LC) Title Results
TK7870.15 .C67 2013 Hermeticity testing of MEMS and microelectronic packages
Hermeticity testing of MEMS and microelectronic packages / 		3
TK7870.15 .D36 1995 Surface mount technology with fine pitch components : the manufacturing issues / 1
TK7870.15 .E39 2002 Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana / 1
TK7870.15 .E39x 2002 Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana / 1
TK7870.15 .E42 2000 Electronic packaging and interconnection handbook / 1
TK7870.15 .E422 2003 Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology--2003 : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C. / 1
TK7870.15 .E422 2004 Electronic and photonics packaging, electrical systems design and photonics, and nanotechnology--[2004] : Allan Kraus Symposium on heat transfer, . . . : [presented at 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California, USA] / 1
TK7870.15 .E422 2005 Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005 : presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA / 1
TK7870.15 .E422 2007 Electronic and photonics packaging : multi-scale electrical and mechanical systems--2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA / 1
TK7870.15 .E4222 1999 Electronic packaging materials and their properties / 1
TK7870.15 .E4222 1999eb Electronic packaging materials and their properties / 2
TK7870.15 .E4223 1999 Electronic packaging for high reliability; low cost electronics / 1
TK7870.15 .E4233 2000 The electronic packaging handbook / 2
TK7870.15 .E43 2021 Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package / 1
TK7870.15 .E434 1994 Electronics packaging forum : multichip module technology issues / 1
TK7870.15 .E45 1993 Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 / 1
TK7870.15 E53 2013 Encyclopedia of thermal packaging. 1
TK7870.15 .E63 2015 Encyclopedia of thermal packaging. a guide to cooling of electronic equipment / 1
TK7870.15 .F65 2003 Foldable flex and thinned silicon multichip packaging technology / 1
TK7870.15 .F65 2003eb Foldable flex and thinned silicon multichip packaging technology / 1