Call Number (LC) Title Results
TK7870.15 .E45 1993 Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 / 1
TK7870.15 E53 2013 Encyclopedia of thermal packaging. 1
TK7870.15 .E63 2015 Encyclopedia of thermal packaging. a guide to cooling of electronic equipment / 1
TK7870.15 .F65 2003 Foldable flex and thinned silicon multichip packaging technology / 1
TK7870.15 .F65 2003eb Foldable flex and thinned silicon multichip packaging technology / 1
TK7870.15 .F86 2000eb Fundamentals of microsystems packaging / 1
TK7870.15 .F86 2001 Fundamentals of microsystems packaging / 1
TK7870.15 .G47 1994 Reliability related research on plastic IC-packages : a test chip approach : a research in the development of silicon test dies for measurement and comparison of molded IC-package reliability = Een onderzoek gericht op de ontwikkeling van silicium test-chips geschikt voor het meten en vergelijken van de bedrijfszekerheid van plastic IC omhullingen / 1
TK7870.15 .G54 2002eb Area array packaging handbook 1
TK7870.15 .G544 2004 Area array packaging materials : adhesives, pastes, and lead-free / 1
TK7870.15 .G55 2005 MEMS/MOEMS packaging : concepts, designs, materials, and processes / 1
TK7870.15 .G56 1991 Electronic equipment packaging technology 1
TK7870.15 .G56 1992 Electronic equipment packaging technology / 1
TK7870.15 .G563 1994 Multichip modules and related technologies : MCM, TAB, and COB design / 1
TK7870.15 .G71 2000 Hermeticity of electronic packages 2
TK7870.15 .G74 2012eb Hermeticity of electronic packages
Hermeticity of electronic packages / 		3
TK7870.15 .H36 1991 Handbook of electronic package design / 1
TK7870.15 .H36 1991eb Handbook of electronic package design 2
TK7870.15 .H364 1994 Handbook of fine pitch surface mount technology / 1
TK7870.15 .H37 1991 Handbook of tape automated bonding / 1