Call Number (LC) Title Results
TK7870.15 .I612 2000 2000 HD International Conference on High-Density Interconnect and Systems Packaging 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA / 1
TK7870.15 .J36 2003 Practical guide to the packaging of electronics : thermal and mechanical design and analysis / 1
TK7870.15 .J36 2016 Practical guide to the packaging of electronics : thermal and mechanical design and analysis / 1
TK7870.15 .J36 2016eb Practical guide to the packaging of electronics : thermal and mechanical design and analysis / 2
TK7870.15 .J56 2011 Introduction to microsystem packaging technology 2
TK7870.15 .J65 Advances in electronic packaging : proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging / 1
TK7870.15 .J686 Journal of microelectronics and electronic packaging. 1
TK7870.15 .L37 1996 Laser diode chip and packaging technology 25-26 October, 1995, Philadelphia, Pennsylvania / 1
TK7870.15 .L425 2005 Lead-free solder interconnect reliability / 1
TK7870.15 .L425 2005eb Lead-free solder interconnect reliability /
Lead-free solder interconnect reliability 		2
TK7870.15 .L43 2004 Lead-free soldering in electronics : science, technology, and environmental impact / 1
TK7870.15 .L43 2004eb Lead-free soldering in electronics : science, technology and environmental impact /
Lead-free soldering in electronics science, technology and environmental impact / 		2
TK7870.15 .L434 2020  
TK7870.15 L447 2008 Three-dimensional integration and modeling a revolution in RF and wireless packaging / 1
TK7870.15 .L53 1995 Multichip module design, fabrication, and testing / 1
TK7870.15 .L58 2011 Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / 1
TK7870.15 .L58 2011eb Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing / 1
TK7870.15 .L58 2012 Power electronic packaging design, assembly process, reliability and modeling / 1
TK7870.15 .M32 2003 Fatigue life prediction of solder joints in electronic packages with ANSYS / 1
TK7870.15 .M34 Manufacturing aspects in electronic packaging. 1