Call Number (LC) Title Results
TK7870.15 .P47 2009eb Solder joint reliability prediction for multiple environments 1
TK7870.15 .P49 1994 Physical architecture of VLSI systems / 1
TK7870.15 .Q35 1994 Quality conformance and qualification of microelectronic packages and interconnects / 1
TK7870.15 .S26 1994 Conceptual design of multichip modules and systems / 1
TK7870.15 .S38 2009 Invention of integrated circuits : untold important facts / 1
TK7870.15 .S39 2005 Force sensors for microelectronic packaging applications / 1
TK7870.15 .S39 2005eb Force sensors for microelectronic packaging applications 1
TK7870.15 .S45 1996 Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia / 1
TK7870.15 S46 1995 Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / 1
TK7870.15 .S54 1995 Introduction to multichip modules / 1
TK7870.15 .S63 1994 Surface mount technology / 1
TK7870.15 .S64 1994 Physical design for multichip modules / 1
TK7870.15 .S74 2001 Copper interconnect technology / 2
TK7870.15 .S77 1998 SMT soldering handbook / 1
TK7870.15 .S77 1998eb SMT soldering handbook 1
TK7870.15 .S78 2014 Microwave and millimeter-wave electronic packaging / 1
TK7870.15 .S787 2014 Microwave and Millimeter-Wave Electronic Packaging. 1
TK7870.15 .S787 2014eb Microwave and millimeter-wave electronic packaging / 2
TK7870.15 .T44 1998 Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California / 1
TK7870.15 .T48 1993eb Thermal stress and strain in microelectronics packaging 1