Call Number (LC) | Title | Results |
---|---|---|
TS590 |
Material Substitution : Lessons from Tin-Using Industries. Product fit and sizing : sustainable product evaluation, engineering, and design / |
2 |
TS590 .H58 | Some recent advances in tinplate manufacturing processes : an address given at the Congresso Imballaggi, Parma, Italy, September, 1954. | 1 |
TS590 .H59 | The technology of tinplate / | 1 |
TS590 .H6 | Tinplate / | 1 |
TS590 .M38 2016 | ||
TS590 .M67 1985 | Tinplate and modern canmaking technology | 1 |
TS600 .C68 1990 | New Mexican tinwork, 1840-1940 / | 1 |
TS610 |
Learn to solder / Reflow soldering : apparatus and heat transfer processes / Recent progress in lead-free solder technology : materials development, processing and performances / Assembly and reliability of lead-free solder joints |
5 |
TS610 .E44 2011 | The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects | 1 |
TS610 .E93 2007 | A guide to lead-free solders : physical metallurgy and reliability / | 1 |
TS610 .E93 2007eb | A guide to lead-free solders physical metallurgy and reliability / | 1 |
TS610 .H84 2004eb | Principles of soldering / | 1 |
TS610 .L43 2007 | Lead-free electronics : iNEMI projects lead to successful manufacturing / | 1 |
TS610 .L43 2007eb | Lead-free electronics iNEMI projects lead to successful manufacturing / | 2 |
TS610 .M44 1993 | The Mechanics of solder alloy wetting and spreading / | 1 |
TS610 .M58 2016eb | Mitigating tin whisker risks : theory and practice / | 3 |
TS610 .P36 2012 | Lead free solder mechanics and reliability / | 1 |
TS610 .P632 v.809 | Scanning imaging technology 2-3 April, 1987, the Hague, the Netherlands / | 1 |
TS610 .S64 | Soldering & surface mount technology : journal of the SMART (Surface Mount & Related Technologies) Group. | 1 |
TS610 .S653 2014eb | Soldering : understanding the basics / | 1 |