Search Results - Zschech, Ehrenfried
- Showing 1 - 9 results of 9
-
1
Stress-induced phenomena in metallization Eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005 /
Published 2006Other Authors: “…Zschech, Ehrenfried…”
Call Number: Loading…Full Text (via Scitation)
Located: Loading…
Electronic Conference Proceeding eBook -
2
Stress management for 3D ICs using through silicon vias international workshop on Stress Management for 3D ICs Using Through Silicon Vias, Albany, NY, U.S.A., March 16, 2010, San F...
Published 2011Other Authors: “…Zschech, Ehrenfried…”
Call Number: Loading…Full Text (via Scitation)
Located: Loading…
Stress Management For 3D Ics Using Through Silicon Vias: International Workshop On Stress Management For 3D Ics Using Through Silicon Vias -- AIP Conference Proceedings
Electronic Conference Proceeding eBook -
3
Stress-induced phenomena in metallization eleventh International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12-14 April 2010 /
Published 2010Other Authors: “…Zschech, Ehrenfried…”
Call Number: Loading…Full Text (via Scitation)
Located: Loading…
Electronic Conference Proceeding eBook -
4
Advanced interconnects for ULSI technology /
Published 2012Other Authors: “…Zschech, Ehrenfried…”
Call Number: Loading…Full Text (via ProQuest)
Located: Loading…
eBook -
5
Materials for information technology devices, interconnects and packaging /
Published 2005Other Authors: “…Zschech, Ehrenfried…”
Call Number: Loading…Full Text (via Springer)
Located: Loading…
Electronic Conference Proceeding eBook -
6
Stress-induced phenomena in metallization Ninth international workshop on stress-induced phenomena in metallization : Kyoto, Japan 4-6 April 2007 /
Published 2007Other Authors: “…Zschech, Ehrenfried…”
Call Number: Loading…Full Text (via Scitation)
Located: Loading…
Electronic Conference Proceeding eBook -
7
Stress-induced phenomena in metallization Tenth International Workshop on Stress-Induced Phenomena in Metallization : Austin, Texas, 5-7 November 2008 /
Published 2009Other Authors: “…Zschech, Ehrenfried…”
Call Number: Loading…Full Text (via Scitation)
Located: Loading…
Electronic Conference Proceeding eBook -
8
Materials for information technology : devices, interconnects and packaging /
Published 2005Other Authors: “…Zschech, Ehrenfried…”
Call Number: Loading…
Located: Loading…Conference Proceeding Book Loading… -
9
Stress-induced phenomena and reliability in 3D microelectronics : Kyoto, Japan, 28-30 May 2012 /
Published 2014Other Authors: “…Zschech, Ehrenfried…”
Call Number: Loading…Full Text (via Scitation)
Located: Loading…
Conference Proceeding eBook
Search Tools:
RSS Feed
–
Save Search
Related Subjects
Interconnects (Integrated circuit technology)
Copper
Defects
Electric properties
Metal-metal bonds
Nanostructured materials
Semiconductors
Strength of materials
Information technology
Materials
Microelectronics
Three-dimensional integrated circuits
Design and construction
Integrated circuits
Measurement
Simulation methods
Strains and stresses
Stress relaxation (Physics)
Ultra large scale integration