Microwave and millimeter-wave electronic packaging / Rick Sturdivant.

Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --

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Bibliographic Details
Online Access: Full Text (via Knovel)
Main Author: Sturdivant, Rick (Author)
Format: eBook
Language:English
Published: Boston [Massachusetts] ; London [England] : Artech House, 2014.
Series:Artech House microwave library.
Subjects:

MARC

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245 1 0 |a Microwave and millimeter-wave electronic packaging /  |c Rick Sturdivant. 
264 1 |a Boston [Massachusetts] ;  |a London [England] :  |b Artech House,  |c 2014. 
264 4 |c ©2014. 
300 |a 1 online resource (281 pages) :  |b illustrations. 
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504 |a Includes bibliographical references at the end of each chapters and index. 
505 0 |a Introduction -- Materials -- Ceramic packaging -- Laminate packaging -- First-level interconnects -- Second-level interconnects -- Modules and motherboards -- Transitions and 3D packaging -- Heat transfer -- Electromagnetic modeling -- Conclusions and future horizons. 
520 |a Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --  |c Edited summary from book. 
588 0 |a Print version record. 
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776 0 8 |i Print version:  |a Sturdivant, Rick.  |t Microwave and millimeter-wave electronic packaging.  |d Boston, [Massachusetts] ; London, [England] : Artech House, ©2014  |h xvii, 261 pages  |k Artech House microwave library.  |z 9781608076970. 
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