Open-mode debonding analysis of curved sandwich panels subjected to heating and cryogenic cooling on opposite faces

Open-mode debonding analysis of curved sandwich panels subjected to heating and cryogenic cooling on opposite faces [microform] / William L. Ko.

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Bibliographic Details
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Main Author:	Ko, William L.
Corporate Author:	NASA Dryden Flight Research Center
Other title:	Open mode debonding analysis of curved sandwich panels subjected to heating and cryogenic cooling on opposite faces.
Format:	Government Document Microfilm Book
Language:	English
Published:	Edwards, Calif. : [Springfield, Va.] : National Aeronautics and Space Administration, Dryden Flight Research Center ; [National Technical Information Service, distributor], [1999]
Series:	NASA technical paper ; 206580.
Subjects:	Aerospace engineering. Sandwich structures. Debonding (Materials) Stress distribution. Curved panels. Structural engineering.

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Norlin Library - Government Information - Microform

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Call Number:	NAS 1.60:206580
NAS 1.60:206580	Restricted Place a Hold

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Call Number:	NAS 1.60:206580
NAS 1.60:206580	Available