Copper interconnect technology / Christoph Steinbrüchel and Barry L. Chin.

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Bibliographic Details
Main Author:	Steinbruchel, Christoph
Other Authors:	Chin, Barry Lee
Format:	Book
Language:	English
Published:	Bellingham, Wash. : SPIE Press, ©2001.
Series:	Tutorial texts in optical engineering ; v. TT 46.
Subjects:	Electronic packaging. Semiconductors > Junctions. Microelectronic packaging. Copper.

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Holdings details from PASCAL Offsite
Call Number:	TK7870.15 .S74 2001
TK7870.15 .S74 2001	Available Place a Hold