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|a (OCoLC)ocm55870692
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|a CODI
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|a QC319.8
|b .I56 2004
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| 090 |
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|a TJ260
|b .I574 2004
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| 111 |
2 |
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|a International Conference on Microchannels and Minichannels
|n (2nd :
|d 2004 :
|c Rochester, N.Y.)
|
| 245 |
1 |
0 |
|a Microchannels and minichannels (ICMM2004) :
|b proceedings of the Second International Conference on Microchannels and Minichannels : presented at the Second International Conference on Microchannels and Minichannels : June 17-19, 2004, Rochester, New York /
|c sponsored the Rochester Institute of Technology ; principal editor, Satish G. Kandlikar ; contributing editors, Gian Piero Celata [and others]
|
| 246 |
3 |
0 |
|a ICMM2004.
|
| 260 |
|
|
|a New York, N.Y. :
|b American Society of Mechanical Engineers,
|c ©2004.
|
| 300 |
|
|
|a xviii, 1,005 pages :
|b illustrations ;
|c 28 cm.
|
| 336 |
|
|
|a text
|b txt
|2 rdacontent.
|
| 337 |
|
|
|a unmediated
|b n
|2 rdamedia.
|
| 338 |
|
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|a volume
|b nc
|2 rdacarrier.
|
| 504 |
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|a Includes bibliographical references and index.
|
| 583 |
1 |
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|a committed to retain
|c 20200101
|d 20450101
|5 CoU
|f Alliance Shared Trust
|u https://www.coalliance.org/shared-print-archiving-policies.
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|a Heat
|x Transmission
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|0 http://id.loc.gov/authorities/subjects/sh2008105543.
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| 650 |
|
0 |
|a Heat sinks (Electronics)
|v Congresses.
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| 700 |
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|a Kandlikar, S. G.
|q (Satish G.)
|0 http://id.loc.gov/authorities/names/n93047464
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|a Celata, G. P.
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|a Rochester Institute of Technology.
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|1 http://isni.org/isni/0000000123233518.
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|a American Society of Mechanical Engineers.
|0 http://id.loc.gov/authorities/names/n80081647
|1 http://isni.org/isni/0000000109406136.
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|p Can circulate
|a University of Colorado Boulder
|b Boulder Campus
|c Offsite
|d PASCAL Offsite
|e QC319.8 .I56 2004
|h Library of Congress classification
|i book
|m P206262002004
|n 1
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