Hybrid microcircuit technology handbook [electronic resource] : materials, processes, design, testing and production / by James J. Licari and Leonard R. Enlow.
Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...
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| Online Access: |
Full Text (via Knovel) |
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| Main Author: | |
| Other Authors: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Westwood, N.J. :
Noyes Publicatons,
©1998.
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| Edition: | 2nd ed. |
| Series: | Materials science and process technology series.
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Table of Contents:
- Introduction
- Substrates
- Thin Film Processes
- Thick Film Processes
- Resistor Trimming
- Parts Selection
- Assembly Processes
- Testing
- Handling and Clean Rooms
- Design Guidelines
- Documentation and Specifications
- Failure Analysis
- Multichip Modules: A New Breed of Hybrid Microcircuits
- References
- Index.