Ion-induced grain growth in multilayer and coevaporated metal alloy thin films [electronic resource]
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| Online Access: |
Online Access |
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| Format: | Government Document Electronic eBook |
| Language: | English |
| Published: |
Washington, D.C : Oak Ridge, Tenn. :
United States. Dept. of Energy. Office of Energy Research ; distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy,
1990.
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| Abstract: | Irradiation experiments were conducted on multilayer (ML) and coevaporated (CO) thin films in order to examine the role that the heat of mixing (ΔH{sub mix}) has in ion-induced grain growth. Room temperature irradiations using 1.7 MeV Xe were performed in the High Voltage Electron Microscope at Argonne National Laboratory. The alloys studied (Pt-Ti, Pt-V, Pt-Ni, Au-Co and Ni-Al) spanned a large range of ΔH{sub mix} values. Comparison of grain growth rates between ML and CO films of a given alloy confirmed a heat of mixing effect. Differences in grain growth rates between ML and CO films scaled according to the sign and magnitude of ΔH{sub mix} of the system (with exception of the Pt-V system). Substantial variations in growth rates among CO alloy films experiencing similar irradiation damage demonstrated that a purely collisional approach is inadequate for describing ion-induced grain growth and consideration must also be given to material-specific properties. Results from CO alloy films were consistent with a thermal spike model of ion-induced grain growth. The grain boundary mobility was observed to be proportional to the thermal spike-related parameter, (F{sub D}²)/(ΔH{sub coh}³), where F{sub D} is the deposited damage energy and ΔH{sub coh} is the cohesive energy. |
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| Item Description: | Published through the Information Bridge: DOE Scientific and Technical Information. 09/01/1990. "conf-900936-22" "DE91004489" ": DMR8603174" "DMR8903138" 7. international conference on ion beam modification of materials, Knoxville, TN (USA), 9-14 Sep 1990. Alexander, D.E.; Was, G.S. . Dept. of Nuclear Engineering; Rehn, L.E. |
| Physical Description: | Pages: (10 p) : digital, PDF file. |