Advanced Standing. New Dimensions in Higher Education. Number 8 [electronic resource] / Shirley A. Radcliffe and Winslow R. Hatch.
The two techniques for advanced standing treated here are (1) the Advanced Placement Program administered by the College Entrance Examination Board and (2) the various plans that enable superior students to take courses in nearby colleges and universities while they are completing their high school...
Saved in:
Online Access: |
Full Text (via ERIC) |
---|---|
Main Author: | |
Corporate Author: | |
Other Authors: | |
Format: | Electronic eBook |
Language: | English |
Published: |
[S.l.] :
Distributed by ERIC Clearinghouse,
1961.
|
Subjects: |
Summary: | The two techniques for advanced standing treated here are (1) the Advanced Placement Program administered by the College Entrance Examination Board and (2) the various plans that enable superior students to take courses in nearby colleges and universities while they are completing their high school programs. Some outcomes of advanced standing practices are: improved communication between the high schools and colleges; greater emphasis on program planning to accommodate individual student abilities and achievements; the opportunity for advanced standing students to include in the collegiate programs studies that they might not normally have had time to pursue; and financial savings to students whose stay in college is shortened by acceleration. More than 25 percent of the four-year colleges and universities subscribe to the principles of the CEEB program, and a number of institutions have developed other advanced standing programs. Reports on the performance of advanced standing students indicate a high degree of satisfaction with this means of motivating superior students and providing them with opportunities to progress at the rates at which they are capable. (Author/LBH) |
---|---|
Item Description: | ERIC Document Number: ED145734. ERIC Note: Parts are marginally legible due to type size. Educational level discussed: Higher Education. |
Physical Description: | 31 p. |