Buffer layers on metal surfaces having biaxial texture as superconductor substrates [electronic resource]
Buffer; Layers; Metal; Surfaces; Biaxial; Texture; Superconductor; Substrates; Buffer; Layer; Architectures; Epitaxially; Deposited; Biaxially-Textured; Rolled; Substrates; Nickel; Copper; Alloys; Current; Conductors; Particularly; Buffer; Layer; Architectures; Ysz; Rare; Earth; Ceo; Ysz; Ceo; Cu; Y...
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Online Access |
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| Main Authors: | , , , |
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| Format: | Government Document Electronic eBook |
| Language: | English |
| Published: |
Oak Ridge, Tenn. : Oak Ridge, Tenn. :
Lockheed Martin Energy Research Corp. ; distributed by the Office of Scientific and Technical Information, U.S. Department of Energy,
2000.
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| 245 | 0 | 0 | |a Buffer layers on metal surfaces having biaxial texture as superconductor substrates |h [electronic resource] |
| 260 | |a Oak Ridge, Tenn. : |b Lockheed Martin Energy Research Corp. ; |a Oak Ridge, Tenn. : |b distributed by the Office of Scientific and Technical Information, U.S. Department of Energy, |c 2000. | ||
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| 500 | |a Published through SciTech Connect. | ||
| 500 | |a 01/01/2000. | ||
| 500 | |a "us 6159610" | ||
| 500 | |a Goyal, Amit; Paranthaman, Mariappan; Kroeger, Donald M.; Lee, Dominic F. | ||
| 520 | 3 | |a Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, RE.sub.2 O.sub.3 /Ni, (RE=Rare Earth), RE.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, RE.sub.2 O.sub.3 /CeO.sub.2 /Ni, and RE.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /CeO.sub.2 /Cu, and RE.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approaches, which include chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray. | |
| 520 | 0 | |a Buffer; Layers; Metal; Surfaces; Biaxial; Texture; Superconductor; Substrates; Buffer; Layer; Architectures; Epitaxially; Deposited; Biaxially-Textured; Rolled; Substrates; Nickel; Copper; Alloys; Current; Conductors; Particularly; Buffer; Layer; Architectures; Ysz; Rare; Earth; Ceo; Ysz; Ceo; Cu; Ysz; Cu; Cu; Cu; Ceo; Cu; Ysz; Ceo; Cu; Deposition; Methods; Physical; Vapor; Deposition; Techniques; Electron-Beam; Evaporation; Rf; Magnetron; Sputtering; Pulsed; Laser; Deposition; Thermal; Evaporation; Solution; Precursor; Approaches; Chemical; Vapor; Deposition; Combustion; Cvd; Metal-Organic; Decomposition; Sol-Gel; Processing; Plasma; Spray; Sol-Gel Process; Magnetron Sputter; Rf Magnetron; Current Conductor; Current Conductors; Deposition Methods; Magnetron Sputtering; Deposition Method; Plasma Spray; Epitaxially Deposited; Metal Surface; Buffer Layer; Buffer Layer; Buffer Layer; Metal Surfaces; Chemical Vapor; Rare Earth; Vapor Deposition; Vapor Deposition; Pulsed Laser; Physical Vapor; Deposition Techniques; Layer Architectures; Layer Architectures; Buffer Layers; Biaxial Texture; Laser Deposition; Solution Precursor; Rolled Substrates; Sol-Gel Processing; Biaxially-Textured Rolled; Precursor Approaches; Particularly Buffer; Metal-Organic Decomposition; Thermal Evaporation; Superconductor Substrates; Deposition Technique; Combustion Cvd; Electron-Beam Evaporation; Beam Evaporation. | |
| 536 | |b AC05-96OR22464. | ||
| 700 | 1 | |a Goyal, Amit |4 aut. | |
| 700 | 1 | |a Paranthaman, Mariappan |4 aut. | |
| 700 | 1 | |a Kroeger, Donald M. |4 aut. | |
| 700 | 1 | |a Lee, Dominic F. |4 aut. | |
| 710 | 2 | |a Lockheed Martin Energy Research Corp. |4 res. | |
| 710 | 1 | |a United States. |b Department of Energy. |b Office of Scientific and Technical Information. |4 dst. | |
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