Far SOL Transport and Main Wall Plasma Interaction in DIII-D [electronic resource]
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| Online Access: |
Online Access (via OSTI) |
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| Corporate Author: | |
| Format: | Government Document Electronic eBook |
| Language: | English |
| Published: |
Washington, D.C. : Oak Ridge, Tenn. :
United States. Department of Energy. ; distributed by the Office of Scientific and Technical Information, U.S. Department of Energy,
2004.
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| Subjects: |
| Abstract: | Far scrape-off layer (SOL) and near-wall plasma parameters in DIII-D depend strongly on the discharge parameters and confinement regime. In L-mode discharges cross-field transport increases with the average discharge density and flattens far SOL profiles, thus increasing plasma-wall contact. In H-mode between edge localized modes (ELMs), plasma-wall contact is generally weaker than in L-mode. During ELMs plasma fluxes to the wall increase to, or above the L-mode levels. Depending on the discharge conditions ELMs are responsible for 30-90% of the ion flux to the outboard chamber wall. Cross-field fluxes in far SOL are dominated by large amplitude intermittent transport events that may propagate all the way to the outer wall and cause sputtering. A Divertor Material Evaluation System (DiMES) probe containing samples of several ITER-relevant materials including carbon, beryllium and tungsten was exposed to a series of upper single null (USN) discharges as a proxy to measure the first wall erosion. |
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| Item Description: | Published through SciTech Connect. 10/19/2004. "ucrl-conf-207411" 45 12 ISSN 0029--5515. Presented at: 20th IAEA Fusion Energy Conference, Vilamoura, Portugal, Nov 01 - Nov 06, 2004. Rudakov, D L; Boedo, J A; Moyer, R A; Stangeby, P C; Watkins, J G; Whyte, D G; Zeng, L; Brooks, N H; Doerner, R P; Evans, T E; Fenstermacher, M E; Groth, M; Hollmann, E M; . Krasheninnikov, S I; Lasnier, C J; Leonard, A W; Mahdavi, M A; McKee, G R; McLean, A G; Pigarov, A Y; Wampler, W R; Wang, G; West, W P; Wong, C C. |
| Physical Description: | PDF-file: 11 pages; size: 0.2 Mbytes. |