Bio and nano packaging techniques for electron devices [electronic resource] : advances in electronic device packaging / Gerald Gerlach, Klaus-Jürgen Wolter, editors.
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Full Text (via Springer) |
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| Other Authors: | , |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Berlin ; New York :
Springer,
©2012.
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| Subjects: |
MARC
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| 245 | 0 | 0 | |a Bio and nano packaging techniques for electron devices |h [electronic resource] : |b advances in electronic device packaging / |c Gerald Gerlach, Klaus-Jürgen Wolter, editors. |
| 260 | |a Berlin ; |a New York : |b Springer, |c ©2012. | ||
| 300 | |a 1 online resource : |b illustrations (some color) | ||
| 336 | |a text |b txt |2 rdacontent. | ||
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| 347 | |a text file. | ||
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| 505 | 0 | 0 | |g Part 1. |t Future of Packaging -- |t Packaging for Electronic Systems / |r Gerald Gerlach -- |t System Integration by Advanced Electronics Packaging / |r Klaus-Jürgen Wolter -- |t Nano- and Biotechniques for Electronic Device Packaging / |r Gerald Gerlach -- |g Part 2. |t 3D Modelling and Design for NEMS -- |t 3D Design / |r Jens Lienig -- |t 3D Data Structures for Nanoscale Design / |r Robert Fischbach -- |t Uncertainty-Based Design Optimization of MEMS/NEMS / |r Holger Neubert -- |g Part 3. |t Nanoparticles and Confined Nanosystems -- |t Physical Effects of Nanoparticles and Nanoparticle Ensembles: Impact to System Packaging / |r Lukas M. Eng -- |t Photochemical Metallization at the Nanoscale / |r Thomas Härtling -- |g Part 4. |t Nanopatterning for NEMS -- |t Nanopatterning and Self-Assembly in Microsystems: An Overview / |r Wolf-Joachim Fischer and Michael Mertig -- |t Direct Nanoimprinting for Micro- and Nanosystems / |r Robert Kirchner, Jonathan Derix, Andreas Nocke and René Landgraf -- |t Platform Technologies for Pico-liter Printing and Nano-imprinting / |r Steffen Howitz and Thomas Wegener -- |t Nanosphere Lithography / |r Martin Waegner -- |t Nano Lithography Based on Domain Patterning of Ferroelectrics / |r Alexander Haussmann -- |t Ink-Jet Printing of Conductive Nanostructures / |r Alexander Türke -- |t Nanoparticle-Based Resistors and Conductors / |r Andreas Nocke and Marcus Wolf -- |t Self-Assembly of Nanowire-Based Field-Effect Transistors / |r Juliane Posseckardt and Michael Mertig -- |g Part 5. |t Nano- and Bio-Funcionalized Surfaces -- |t Interfacing of Biosystems / |r Gerhard Rödel and Wolfgang Pompe -- |t Optical Absorption Layers for Infrared Radiation / |r Marco Schossig -- |t Packaging in Synthetic Biology / |r Jakob Schweizer, Matthias Garten and Petra Schwille -- |t S-Layer Proteins as Self-Assembly Tool in Nano Bio Technology / |r Melinda Varga and Nuriye Korkmaz -- |t Biofunctionalization of Surfaces Using Ultrathin Nanoscopic Collagen Matrices / |r Jens Friedrichs, Anna Taubenberger, Susanne Wegmann, David A. Cisneros and Clemens Franz, et al. -- |g Part 6. |t Biocompatible Materials and Packaging -- |t Electromagnetic Aspects in Cell Biology / |r Richard H.W. Funk -- |t DC Electrodes for Cell Applications / |r Jonathan Derix and Srikanth Perike -- |t Biocompatibility of Packaging Materials / |r Jürgen Uhlemann, Robert Kirchner and Klaus-Jürgen Wolter -- |t Biostability of Electronic Packaging Materials / |r Nataliia Beshchasna -- |g Part 7. |t System-in-Package for MEMS, Bio-MEMS and MOEMS -- |t Scaling Effects for Miniaturized Solder Interconnects in Electronic Packages / |r Maik Müller and Klaus-Jürgen Wolter -- |t Photonic System Integration of Optical Waveguides in MOEMS / |r Ralf Rieske -- |t Biosensing with Optical Waveguides / |r Tobias Schuster, René Landgraf, Andreas Finn and Michael Mertig -- |t Direct Encapsulation of OLED on CMOS / |r Christian Schmidt -- |t A Hierarchical Modeling Approach of Thermal Vias Using CNT-based Composites / |r Jörg Hertwig, Holger Neubert and Jens Lienig. |
| 504 | |a Includes bibliographical references and index. | ||
| 520 | 8 | |a Annotation |b This text offers an overview of nanoscale components and systems comprising electronic, mechanical and optical structures, describes trends and developments in electron device packaging, and discusses application of nano and bio techniques in future solutions. | |
| 650 | 0 | |a Microelectronic packaging. |0 http://id.loc.gov/authorities/subjects/sh85084821. | |
| 650 | 7 | |a Microelectronic packaging. |2 fast |0 (OCoLC)fst01019751. | |
| 700 | 1 | |a Gerlach, Gerald. |0 http://id.loc.gov/authorities/names/n2007087627 |1 http://isni.org/isni/0000000116167997. | |
| 700 | 1 | |a Wolter, Klaus-Jürgen. |0 http://id.loc.gov/authorities/names/no2011001060. | |
| 776 | 0 | 8 | |i Print version: |z 9783642285219. |
| 856 | 4 | 0 | |u https://colorado.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-642-28522-6 |z Full Text (via Springer) |
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| 952 | f | f | |p Can circulate |a University of Colorado Boulder |b Online |c Online |d Online |e TK7870.15 .B56 2012 |h Library of Congress classification |i Ebooks, Prospector |n 1 |