Foldable flex and thinned silicon multichip packaging technology / edited by John W. Balde.

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages...

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Bibliographic Details

Online Access:	Full Text (via Springer)
Other Authors:	Balde, John W., 1923-
Format:	eBook
Language:	English
Published:	Boston : Kluwer Academic Publishers, [2003]
Series:	Emerging technology in advanced packaging series ; 1.
Subjects:	Microelectronic packaging. Multichip modules (Microelectronics) Chip scale packaging. Flexible printed circuits.