RF and microwave microelectronics packaging II / Ken Kuang, Rick Sturdivant, editors.

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Bibliographic Details
Online Access:	Full Text (via Springer)
Other Authors:	Kuang, Ken (Editor), Sturdivant, Rick (Editor)
Format:	eBook
Language:	English
Published:	Cham, Switzerland : Springer, 2017.
Subjects:	Microelectronic packaging.

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Full Text (via Springer)

Holdings details from Online
Call Number:	TK7870.15
TK7870.15	Available