RF and microwave microelectronics packaging II / Ken Kuang, Rick Sturdivant, editors.
Saved in:
Online Access: |
Full Text (via Springer) |
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Other Authors: | , |
Format: | eBook |
Language: | English |
Published: |
Cham, Switzerland :
Springer,
2017.
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Subjects: |
Item Description: | Includes index. |
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Physical Description: | 1 online resource (xii, 172 pages) : illustrations (some color) |
ISBN: | 9783319516974 3319516973 |
Source of Description, Etc. Note: | Source of description: Online resource; title from PDF title page (SpringerLink, viewed March 22, 2017) Source of description: Print version record. |