Specification for multilayer hybrid circuits / a standard developed by the Hybrid Circuits Committee of the Institute for Interconnecting and Packaging Electronic Circuits.

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Bibliographic Details
Corporate Authors:	Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.), American National Standards Institute
Format:	Book
Language:	English
Published:	Lincolnwood, Illinois : IPC, 1987.
Subjects:	Thick-film circuits. Hybrid integrated circuits.

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Call Number:	TA368 .A55 ANSI/IPC-HM-860
TA368 .A55 ANSI/IPC-HM-860	Available Place a Hold