Optimization of Signal and Return via in PCB for 20 GHz BW Signal / Aakriti Srivastava.

The high speed multilayer printed circuit board design requires in depth understanding of signal integrity. Localization of via plays a significant role in board design and the output that can be achieved from the board. Hence this thesis is focused on optimization of signal and return via in the PC...

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Bibliographic Details
Online Access: Connect to online resource
Main Author: Srivastava, Aakriti (Author)
Format: Thesis Electronic eBook
Language:English
Published: Ann Arbor : ProQuest Dissertations & Theses, 2023.
Subjects:

MARC

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245 1 0 |a Optimization of Signal and Return via in PCB for 20 GHz BW Signal /  |c Aakriti Srivastava. 
264 1 |a Ann Arbor :  |b ProQuest Dissertations & Theses,  |c 2023. 
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500 |a Source: Masters Abstracts International, Volume: 84-12. 
500 |a Advisors: Piket-May, Melinda Committee members: Bogatin, Eric; Hadi, Mohammed. 
502 |b M.S.  |c University of Colorado at Boulder  |d 2023. 
520 |a The high speed multilayer printed circuit board design requires in depth understanding of signal integrity. Localization of via plays a significant role in board design and the output that can be achieved from the board. Hence this thesis is focused on optimization of signal and return via in the PCB for 20 GHz BW signal. The majority of analysis of this work required 3D field solver for which Ansys HFSS tool is primarily used. So, it becomes an important part of this research work to establish best simulation practice in Ansys 2D extractor and 3D to have confidence in accuracy of the results. As a result, this research work is primarily divided into two sections first part deals with establishing the best simulation practices that can be can be extended to other, more complex structures and applied to other field solver tools. Second part is dedicated to develop the methodology to optimize signal and return via which reduces radiation loss in the cavity. 
546 |a English 
650 0 |a Electromagnetism.  |0 http://id.loc.gov/authorities/subjects/sh85042184 
650 0 |a Electrical engineering.  |0 http://id.loc.gov/authorities/subjects/sh85041666 
650 0 |a Computational physics.  |0 http://id.loc.gov/authorities/subjects/sh2022007579 
653 |a Signal integrity 
653 |a PCB 
653 |a Radiation loss 
653 |a Localization 
653 |a Ansys 2D extractor 
655 7 |a Theses  |x CU Boulder  |x Electrical Engineering.  |2 local 
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