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Advanced RF MEMS / edited by Stepan Lucyszyn.

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"An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. Reviews RF MEMS technologies -- Illustrates new te...

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Bibliographic Details
Online Access: Full Text (via Cambridge)
Other Authors: Lucyszyn, S. (Stepan)
Format: Electronic eBook
Language:English
Published: Cambridge, UK ; New York : Cambridge University Press, 2010.
Series:Cambridge RF and microwave engineering series.
Subjects:
Radio frequency microelectromechanical systems.
Table of Contents:
  • Cover
  • Half-Title
  • Title
  • Copyright
  • Dedication
  • Contents
  • Contributors
  • Preface
  • Abbreviations
  • 1 Introduction
  • 1.1 Introduction
  • 1.1.1 Defining Terms
  • 1.1.2 Enabling Technology Roadmap
  • 1.2 Fabrication Technologies
  • 1.3 Electromechanical Actuation
  • 1.4 Generic Rf Mems Components
  • 1.4.1 Switches
  • 1.4.2 Variable Capacitors
  • 1.4.3 Antennas
  • 1.5 Circuits and Subsystems
  • 1.6 Conclusions
  • References
  • 2 Electromechanical Modelling of Electrostatic Actuators
  • 2.1 Introduction
  • 2.2 Energy Methods and the Equilibrium/Momentum Equation
  • 2.3 Static Equilibrium and Stability
  • 2.3.1 Actuators With One Degree of Freedom
  • 2.3.2 Actuators With Several Degrees of Freedom
  • 2.3.3 Distributed Systems
  • 2.3.4 Numerical Methods
  • 2.4 Dynamic Response of Electrostatic Actuators
  • 2.4.1 Dynamic Pull-in of a One-Dof System
  • 2.4.2 Dynamic Pull-in of the Clamped-Clamped Beam Actuator
  • 2.4.3 Switching Time of Electrostatic Actuators
  • 2.5 Conclusions
  • References
  • 3 Switches and Their Fabrication Technologies
  • 3.1 Introduction
  • 3.2 Substrate Materials and Fabrication Technologies
  • 3.3 Actuation Principles
  • 3.3.1 Capacitive Switches With Electrostatic Actuation
  • 3.3.2 Ohmic Switches With Electrostatic Actuation
  • 3.3.3 Switches With Piezoelectric Actuation
  • 3.3.4 Switches With Electrothermal and Electromagnetic Actuation
  • 3.4 Switch Building Blocks
  • 3.4.1 Metallisation
  • 3.4.2 Capacitive Switch Dielectrics
  • 3.4.3 Ohmic Switch Contacts
  • 3.4.4 Sacrificial Layers
  • 3.4.5 Moveable Structures
  • References
  • 4 Niche Switch Technologies
  • 4.1 Introduction
  • 4.2 Latching Switches
  • 4.2.1 Magnetically Actuated Bistable Switches
  • 4.2.2 Electrothermally Actuated Bistable Switches
  • 4.2.3 Electrostatic Bistable Switch
  • 4.2.4 Mechanically Latching Switches
  • 4.3 Multiway Switches
  • 4.3.1 Spdt Switches
  • 4.3.2 Sp4T Switches
  • 4.3.3 Sp6T Switches
  • 4.3.4 Sp8T Switches
  • 4.3.5 Sp9T Switches and Sp48T Modules
  • 4.3.6 Dpdt Switches
  • 4.3.7 Switch Matrices
  • 4.4 High-Power Switches
  • 4.4.1 Additional Hold Electrodes
  • 4.4.2 Beam Cross Section
  • 4.4.3 Switching Arrays
  • 4.4.4 Contact Force
  • 4.4.5 Materials
  • 4.4.6 Non-Beam Architectures
  • 4.4.7 Unconventional 3D Power Switch
  • 4.4.8 Rf Power Measurements
  • References
  • 5 Reliability
  • 5.1 Introduction
  • 5.1.1 Terminology
  • 5.1.2 Failure- and Application-Driven Reliability Methodology
  • 5.2 Failure Mechanisms in Rf Mems
  • 5.2.1 Creep/Stress Relaxation
  • 5.2.2 Temperature- and Stress-Induced Plastic Deformation
  • 5.2.3 Temperature-Induced Elastic Deformation
  • 5.2.4 Fatigue
  • 5.2.5 Stiction
  • 5.2.6 Electromigration
  • 5.2.7 Self-Actuation
  • 5.2.8 Fly-Catching Effect
  • 5.2.9 Outgassing and Adsorption
  • 5.2.10 Mechanical and Acoustic Coupling
  • 5.3 Conclusions
  • 5.4 Acknowledgments
  • Refe.

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