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    COST ANALYSIS OF ELECTRONIC SYSTEMS. by Sandborn, Peter

    Published 2012
    “…WSPC series in advanced integration and packaging.…”
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  2. 2
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    Thermoelectric Energy Conversion Devices And Systems / Kazuaki Yazawa, Je-Hyeong Bahk, Ali Shakouri. by Yazawa, Kazuaki, Bahk, Je-hyeong, Shakoori, Ali, 1962-

    Published 2021
    “…WSPC series in advanced integration and packaging ;…”
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  3. 3
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    MEMS packaging / edited by Y.C. Lee (University of Colorado, Boulder, USA), Yu-Ting Cheng (National Chiao Tung University, Taiwan), Ramesh Ramadoss (IoT Technologies Inc., USA)

    Published 2018
    “…WSPC series in advanced integration and packaging ;…”
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    Cooling of microelectronic and nanoelectronic equipment : advances and emerging research / Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia, editors.

    Published 2015
    “…WSPC series in advanced integration and packaging ;…”
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  5. 5
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    Cooling of microelectronic and nanoelectronic equipment : advances and emerging research / editors, Madhusudan Iyengar, Facebook, USA, Karl J.L. Geisler, 3M, USA, Bahgat Sammakia,...

    Published 2015
    “…WSPC series in advanced integration and packaging ;…”
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