MEMS packaging / edited by Y.C. Lee (University of Colorado, Boulder, USA), Yu-Ting Cheng (National Chiao Tung University, Taiwan), Ramesh Ramadoss (IoT Technologies Inc., USA)
Saved in:
| Other Authors: | , , |
|---|---|
| Other title: | MEMS packaging (World Scientific (Firm)) CU Boulder Author Collection. |
| Format: | Book |
| Language: | English |
| Published: |
[Hackensack?] New Jersey :
World Scientific,
[2018]
|
| Series: | WSPC series in advanced integration and packaging ;
vol. 5. |
| Subjects: |
Closed Stacks - Engineering Math & Physics Library - Stacks
| Call Number: |
TK7875 .M4575 2018
|
|---|---|
| TK7875 .M4575 2018 | Available Place a Hold |