MEMS packaging / edited by Y.C. Lee (University of Colorado, Boulder, USA), Yu-Ting Cheng (National Chiao Tung University, Taiwan), Ramesh Ramadoss (IoT Technologies Inc., USA)
Saved in:
| Other Authors: | , , |
|---|---|
| Other title: | MEMS packaging (World Scientific (Firm)) CU Boulder Author Collection. |
| Format: | Book |
| Language: | English |
| Published: |
[Hackensack?] New Jersey :
World Scientific,
[2018]
|
| Series: | WSPC series in advanced integration and packaging ;
vol. 5. |
| Subjects: |
MARC
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| 245 | 1 | 0 | |a MEMS packaging / |c edited by Y.C. Lee (University of Colorado, Boulder, USA), Yu-Ting Cheng (National Chiao Tung University, Taiwan), Ramesh Ramadoss (IoT Technologies Inc., USA) |
| 264 | 1 | |a [Hackensack?] New Jersey : |b World Scientific, |c [2018] | |
| 264 | 4 | |c ©2018. | |
| 300 | |a xiv, 248 pages : |b illustrations ; |c 24 cm. | ||
| 336 | |a text |b txt |2 rdacontent. | ||
| 337 | |a unmediated |b n |2 rdamedia. | ||
| 338 | |a volume |b nc |2 rdacarrier. | ||
| 490 | 1 | |a WSPC series in advanced integration and packaging ; |v volume 5. | |
| 504 | |a Includes bibliographical references and index. | ||
| 650 | 0 | |a Microelectromechanical systems. |0 http://id.loc.gov/authorities/subjects/sh97007351. | |
| 650 | 0 | |a Microelectronic packaging. |0 http://id.loc.gov/authorities/subjects/sh85084821. | |
| 700 | 1 | |a Lee, Yung-Cheng, |e editor. |0 http://id.loc.gov/authorities/names/n87805412 |1 http://isni.org/isni/0000000081136946. | |
| 700 | 1 | |a Cheng, Yu-Ting, |e editor. |0 http://id.loc.gov/authorities/names/n2017075722. | |
| 700 | 1 | |a Ramadoss, Ramesh, |e editor. |0 http://id.loc.gov/authorities/names/n2017075725. | |
| 730 | 0 | |a CU Boulder Author Collection. | |
| 830 | 0 | |a WSPC series in advanced integration and packaging ; |v vol. 5. |0 http://id.loc.gov/authorities/names/no2014023495. | |
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