Advanced wirebond interconnection technology / by Shankara K. Prasad.

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Bibliographic Details
Online Access:	Full Text (via Springer)
Main Author:	Prasad, Shankara K.
Format:	eBook
Language:	English
Published:	Boston : Kluwer Academic Publishers, ©2004.
Subjects:	Wire bonding (Electronic packaging) > Production control. Electronic packaging > Reliability.

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Full Text (via Springer)

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Call Number:	TK7836 .P715 2004eb
TK7836 .P715 2004eb	Available