Introduction to microsystem packaging technology [electronic resource] / Yufeng Jin, Zhiping Wang, Jing Chen.

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in...

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Bibliographic Details

Online Access:	Full Text (via Taylor & Francis)
Main Author:	Jin, Yufeng
Other Authors:	Wang, Zhiping, 1962 October 6-, Chen, Jing, 1974-
Format:	Electronic eBook
Language:	English
Published:	Boca Raton, FL : CRC Press/Taylor & Francis, ©2011.
Subjects:	Microelectronic packaging.