Characterization of integrated circuit packaging materials / editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick.

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues ar...

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Bibliographic Details

Online Access:	Full Text (via O'Reilly/Safari)
Other Authors:	Moore, Thomas M., McKenna, Robert G.
Format:	eBook
Language:	English
Published:	Boston : Butterworth-Heinemann, ©1993.
Series:	Materials characterization series.
Subjects:	Electronic packaging > Materials. Integrated circuits > Design and construction. Electronic packaging > Materials Integrated circuits > Design and construction