Avoiding inelastic strains in solder joint interconnections of IC devices / authored by: Ephraim Suhir.
"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic p...
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| Online Access: |
Full Text (via Taylor & Francis) |
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| Main Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
Boca Raton, FL :
CRC Press,
2020.
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| Edition: | First edition. |
| Subjects: |
Internet
Full Text (via Taylor & Francis)Online
| Call Number: |
TK7874.53 .S84 2021eb
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| TK7874.53 .S84 2021eb | Available |