Avoiding inelastic strains in solder joint interconnections of IC devices / authored by: Ephraim Suhir.
"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic p...
Saved in:
| Online Access: |
Full Text (via Taylor & Francis) |
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| Main Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
Boca Raton, FL :
CRC Press,
2020.
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| Edition: | First edition. |
| Subjects: |
| Summary: | "The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"-- |
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| Physical Description: | 1 online resource : illustrations. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9780429460470 0429460473 9780429863820 0429863829 9780429863813 0429863810 9780429863806 0429863802 |
| Source of Description, Etc. Note: | Source of description: Description based on online resource, title from digital title page (viewed on February 25, 2021) |
| Biographical or Historical Data: | Ephraim Suhir is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE); the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE) and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored about 400+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including the 1996 Bell Labs Distinguished Member of Technical Staff Award and the 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering. He is the third Russian American, after Stephen Timoshenko and Igor Sikorsky, who received this prestigious award. |