Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package / edited by Beth Keser, Steffen Kröhnert.
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an...
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Full Text (via IEEE) |
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Other Authors: | , |
Format: | eBook |
Language: | English |
Published: |
Newark :
John Wiley & Sons, Incorporated,
2021.
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Internet
Full Text (via IEEE)Online
Call Number: |
TK7870.15 .E43 2021
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TK7870.15 .E43 2021 | Available |