Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package / edited by Beth Keser, Steffen Kröhnert.

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an...

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Bibliographic Details
Online Access: Full Text (via IEEE)
Other Authors: Keser, Beth, 1971- (Editor), Kröhnert, Steffen (Editor)
Format: eBook
Language:English
Published: Newark : John Wiley & Sons, Incorporated, 2021.
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Call Number: TK7870.15 .E43 2021
TK7870.15 .E43 2021 Available