Wire bonding in microelectronics / George Harman.

Presenting a definitive resource on the critical process of connecting semiconductors with their packages; this authoritative guide covers every aspect of designing; manufacturing; and evaluating wire bonds engineered with cutting-edge techniques. --

Bibliographic Details

Online Access:	Full Text (via Skillsoft)
Main Author:	Harman, George G.
Format:	Electronic eBook
Language:	English
Published:	New York : McGraw-Hill, ©2010.
Edition:	3rd ed.
Subjects:	Wire bonding (Electronic packaging) > Production control. Electronic packaging > Reliability. Electronic packaging > Defects. Semiconductors > Failures. Microelectronics. Ultrasonic welding. Electronic packaging > Defects Electronic packaging > Reliability Microelectronics Semiconductors > Failures Ultrasonic welding Wire bonding (Electronic packaging) > Production control Internet resources.