Cooling of microelectronic and nanoelectronic equipment : advances and emerging research / Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia, editors.
To celebrate Professor Avi Bar-Cohen''s 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nano...
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| Online Access: |
Full Text (via ProQuest) |
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| Other Authors: | , , |
| Format: | eBook |
| Language: | English |
| Published: |
Singapore :
World Scientific Publishing Company,
2015.
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| Series: | WSPC series in advanced integration and packaging ;
Volume 3. |
| Subjects: |
Table of Contents:
- Dedication; Contents; 1. A Review of Cooling Road Maps for 3D Chip Packages; Introduction; TSV Fabrication; Thermal-Mechanical-Electrical Challenges in 3-D; Acknowledgement; References; 2. Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks; 1. Introduction; 2. Passive Immersion Cooling; 2.1. Single Phase Natural Convection; 2.2. Pool Boiling; 3. Pumped Liquid Systems; 3.1. Single Phase Forced Convection; 3.2. Flow Boiling; 4. Performance Maps; 5. Conclusions; References; 3. Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency; 1. Introduction.
- 1.1. Thermal Issues in Modern Computer Chips1.2. Dynamic Thermal Management; 1.3. Temperature-leakage Interdependency; 1.4. Motivation of DTM Considering Temperature-leakage Interdependency; 2. RC Thermal Model Considering Leakage; 2.1. Single Core RC Thermal Model; 2.2. Leakage and Temperature Dependency; 2.3. Thermal Model with Leakage Power; 2.3.1. Case 1; 2.3.2. Case 2; 2.3.3. Case 3; 3. Thermal Aware Speed and Task Scheduling; 3.1. Problem Formulation; 3.2. Dynamic Programming with Fixed Task Order; 3.3. Considering Task Rescheduling; 3.3.1. Dynamic Programming with Task Scheduling.
- 3.3.2. Heuristic to Improve the Computation Speed4. Simulated Test Case; 4.1. Comparison 1: With Existing Leakage-temperature Models; 4.2. Comparison 2: Fixed Order, Full Rescheduling and Grouping; 5. Conclusion and Future Work; 5.1. Conclusion; 5.2. Future Work; Acknowledgments; References; 4. Energy Reduction and Performance Maximization Through Improved Cooling; Introduction; Leakage Current Effects; Improved Cooling; Performance Modeling; Reliability Concerns; Frequency Improvements; System Performance; Total Cost of Ownership; Conclusions; Acknowledgments; References.
- 5. Optimal Choice of Heat Sinks from an Industrial Point of View1. Introduction; 2. Heat Sink Basics; 2.1. The Murray-Gardner assumptions; 2.2. Heat spreading; 2.3. Radiation; 3. Heat Sink Modeling Approaches from a Designer's Perspective; 3.1. Approaches not recommended; 3.2. Approaches to acquire insight in the basic physics; 3.3. Approaches to acquire insight in optimization parameters; 3.4. Approaches to acquire insight in fluid dynamics; 3.5. Approaches suited for final design of heat sinks in LED applications; 3.6. Pitfalls to avoid; 3.7. Why more expensive heat sinks can save money.
- 4. ConclusionsReferences; 6. Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems; Introduction; Background; Synthetic Jets Design and Measurement Approaches; Numerical Modeling of a Synthetic Jet; Heat Transfer Experiments; Velocity Measurements; Pressure Measurements; Enhancing Heat Transfer with Synthetic Jets; Natural Convection Heat Transfer with Synthetic Jets; Enhancing Heat Sink Thermal Performance with Embedded Synthetic Jets; Forced Convection Heat Transfer with Synthetic Jets; Synthetic Jets in Practical Applications; Synthetic Jet Heat Transfer Correlation.