HOTPAC [microform] : programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML / John Albers.

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Bibliographic Details
Main Author:	Albers, John
Corporate Author:	National Institute of Standards and Technology (U.S.)
Other title:	HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program. Programs for thermal analysis including version 3.0 of the TXYZ program.
Format:	Government Document Microfilm Book
Language:	English
Published:	Gaithersburg, MD : Washington, DC : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O., 1995.
Series:	Semiconductor measurement technology. NIST special publication ; 400-96.
Subjects:	Semiconductors > Thermal properties. Thermal analysis > Computer programs.

Norlin Library - Government Information - Microform

Holdings details from Norlin Library - Government Information - Microform
Call Number:	C 13.10:400-96
C 13.10:400-96	Restricted Place a Hold