Evaluation of the transient liquid phase (TLP) bonding process for Ti₃-Based honeycomb core sandwich structure [microform] / R. Keith Bird and Eric K. Hoffman.
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Format: | Government Document Microfilm Book |
Language: | English |
Published: |
Hampton, Va. : Springfield, VA :
National Aeronautics and Space Administration, Langley Research Center ; National Technical Information Service, distributor,
[1998]
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Series: | NASA technical paper ;
208421. |
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Internet
Click here to view paper onlineNorlin Library - Government Information - Microform
Call Number: |
NAS 1.60:208421
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NAS 1.60:208421
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NAS 1.60:208421 | Available |