Evaluation of the transient liquid phase (TLP) bonding process for Ti₃-Based honeycomb core sandwich structure [microform] / R. Keith Bird and Eric K. Hoffman.

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Main Author: Bird, R. Keith
Corporate Author: Langley Research Center
Other Authors: Hoffman, Eric K.
Format: Government Document Microfilm Book
Language:English
Published: Hampton, Va. : Springfield, VA : National Aeronautics and Space Administration, Langley Research Center ; National Technical Information Service, distributor, [1998]
Series:NASA technical paper ; 208421.
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Norlin Library - Government Information - Microform

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Call Number: NAS 1.60:208421
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Call Number: NAS 1.60:208421
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