Photonics packaging and integration IV [electronic resource] : 29 January 2003, San Jose, California, USA / Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.

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Bibliographic Details
Online Access:	Full Text (via SPIE Digital Library)
Corporate Authors:	Society of Photo-Optical Instrumentation Engineers, SPIE Digital Library
Other Authors:	Heyler, Randy A., Chen, Ray T.
Other title:	Photonics packaging and integration 4. Photonics packaging and integration four. Optoelectronic interconnects. Photonics packaging and integration.
Format:	Electronic eBook
Language:	English
Published:	Bellingham, Wash., USA : SPIE, ©2004.
Series:	Proceedings of SPIE--the International Society for Optical Engineering ; v. 5358.
Subjects:	Optoelectronic devices > Design and construction > Congresses. Optical interconnects > Congresses. Microelectronic packaging > Congresses. Photonics > Congresses. Microelectronic packaging. Optical interconnects. Optoelectronic devices > Design and construction. Photonics. Conference papers and proceedings.

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Call Number:	TA1750 .O66925 2004
TA1750 .O66925 2004	Available