Reliability, packaging, testing, and characterization of MEMS/MOEMS VI [electronic resource] : 23-24 January, 2007, San Jose, California, USA / Allyson L. Hartzell, Rajeshuni Ramesham, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering.

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Bibliographic Details
Online Access:	Full Text (via SPIE Digital Library)
Corporate Author:	Society of Photo-Optical Instrumentation Engineers
Other Authors:	Hartzell, Allyson L., Ramesham, Rajeshuni
Other title:	SPIE digital library. Reliability, testing and characterization of MEMS/MOEMS VI.
Format:	Electronic eBook
Language:	English
Published:	Bellingham, Wash. : SPIE, ©2007.
Series:	Proceedings of SPIE--the International Society for Optical Engineering ; v. 6463.
Subjects:	Microelectromechanical systems > Reliability > Congresses. Microelectromechanical systems > Testing > Congresses. Microelectronic packaging > Congresses.

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Call Number:	TK7875 .R438 2007
TK7875 .R438 2007	Available