Three dimensional system integration [electronic resource] : IC stacking process and design / edited by Antonis Papanikolaou, Dimitrios Soudris and Riko Radojcic.

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...

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Bibliographic Details

Online Access:	Full Text (via Springer)
Other Authors:	Papanikolaou, Antonis, Soudris, Dimitrios, 1964-, Radojcic, Riko
Format:	Electronic eBook
Language:	English
Published:	New York ; London : Springer, 2010.
Subjects:	Integrated circuit layout.