Interfacial compatibility in microelectronics [electronic resource] : moving away from the trial and error approach / Tomi Laurila [and others]
Annotation
Saved in:
| Online Access: |
Full Text (via Springer) |
|---|---|
| Other Authors: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
London ; New York :
Springer-Verlag London,
©2012.
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| Series: | Microsystems (Series)
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| Subjects: |
MARC
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| 245 | 0 | 0 | |a Interfacial compatibility in microelectronics |h [electronic resource] : |b moving away from the trial and error approach / |c Tomi Laurila [and others] |
| 260 | |a London ; |a New York : |b Springer-Verlag London, |c ©2012. | ||
| 300 | |a 1 online resource (ix, 217 pages) : |b illustrations (some color) | ||
| 336 | |a text |b txt |2 rdacontent. | ||
| 337 | |a computer |b c |2 rdamedia. | ||
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| 347 | |a text file. | ||
| 347 | |b PDF. | ||
| 490 | 1 | |a Microsystems, |x 1389-2134. | |
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Introduction: Away from trial and error methods -- Materials and interfaces in Microsystems -- Introduction to mechanics of materials -- Introduction to thermodynamic-kinetic method -- Interfacial adhesion in polymer systems -- Evolution of different types of interfacial structures. | |
| 520 | 8 | |a Annotation |b This volume provides solutions to several common reliability issues in microsystem packaging. It teaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materials. | |
| 546 | |a English. | ||
| 650 | 0 | |a Microelectronics. |0 http://id.loc.gov/authorities/subjects/sh85084822. | |
| 650 | 7 | |a Microelectronics. |2 fast |0 (OCoLC)fst01019757. | |
| 700 | 1 | |a Laurila, Tomi. |0 http://id.loc.gov/authorities/names/no2012063305 |1 http://isni.org/isni/0000000370696472. | |
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