Solder joint reliability assessment : finite element simulation methodology / Mohd N. Tamin, Norhashimah M. Shaffiar.

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder jointsubjected to reliability test conditions are elaborated. These cover...

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Bibliographic Details

Online Access:	Full Text (via Springer)
Main Authors:	Tamin, Mohd N. (Author), Shaffiar, Norhashimah M. (Author)
Format:	eBook
Language:	English
Published:	Cham : Springer, 2014.
Series:	Advanced structured materials ; 37.
Subjects:	Solder and soldering. Welded joints > Reliability.