Stress-induced phenomena and reliability in 3D microelectronics : Kyoto, Japan, 28-30 May 2012 / editors, Paul S. Ho, University of Texas, Texas, USA, Chao-Kun Hu, IBM T.J. Watson Research Center, New York, USA, Mark Nakamoto, Qualcomm Incorporated, California, USA, Shinichi Ogawa, Advanced Industrial Science and Technology, Ibaraki, Japan, Valeriy Sukharev, Mentor Graphics Corporation, California, USA, Larry Smith, SEMATECH, New York, USA, Ehrenfried Zschech, Frauhofer Institute for Ceramic Technologies and Systems, Dresden, Germany.