The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages / by Gerard Kelly.

This book is motivated by the need to understand and predict the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. Failures like delaminations, package cracking, and metal shift occur due to the build-up of residu...

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Bibliographic Details

Online Access:	Full Text (via Springer)
Main Author:	Kelly, Gerard
Format:	eBook
Language:	English
Published:	Boston, MA : Springer US, 1999.
Subjects:	Engineering. Mechanics. Machinery. Computer engineering. Systems engineering. Surfaces (Physics)