Foldable flex and thinned silicon multichip packaging technology / edited by John W. Balde.
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages...
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| Online Access: |
Full Text (via Springer) |
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| Other Authors: | |
| Format: | eBook |
| Language: | English |
| Published: |
Boston :
Kluwer Academic Publishers,
[2003]
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| Series: | Emerging technology in advanced packaging series ;
1. |
| Subjects: |
| Summary: | Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. |
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| Physical Description: | 1 online resource (xix, 338 pages) : illustrations. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9781461502319 1461502314 |
| Source of Description, Etc. Note: | Print version record. |