Advances in electronic circuit packaging. Vol 3, Proceedings of the International Electronic Circuit Packaging Symposium / edited by Lawrence L. Rosine.

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Bibliographic Details
Online Access:	Full Text (via Springer)
Corporate Authors:	International Electronic Circuit Packaging Symposium Boulder, Colo., University of Colorado (Boulder campus)
Other Authors:	Rosine, Lawrence L. (Editor)
Other title:	Electrical design news. Design news.
Format:	Conference Proceeding eBook
Language:	English
Subjects:	Electronic packaging > Congresses. Electronic packaging. Conference papers and proceedings.

Internet

Full Text (via Springer)

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Call Number:	TK7870
TK7870	Available