Wafer level 3-D ICs process technology [electronic resource] / edited by Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif.

Annotation This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This...

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Bibliographic Details
Online Access: Full Text (via Springer)
Other Authors: Tan, Chuan Seng, Gutmann, Ronald J., Reif, Rafael
Format: Electronic eBook
Language:English
Published: New York ; London : Springer, 2008.
Series:Series on integrated circuits and systems.
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Call Number: TK7874 .W34 2008
TK7874 .W34 2008 Available