Wafer level 3-D ICs process technology [electronic resource] / edited by Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif.

Annotation This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This...

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Bibliographic Details

Online Access:	Full Text (via Springer)
Other Authors:	Tan, Chuan Seng, Gutmann, Ronald J., Reif, Rafael
Format:	Electronic eBook
Language:	English
Published:	New York ; London : Springer, 2008.
Series:	Series on integrated circuits and systems.
Subjects:	Integrated circuits > Wafer-scale integration.