Wafer level 3-D ICs process technology [electronic resource] / edited by Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif.
Annotation This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This...
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Online Access: |
Full Text (via Springer) |
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Other Authors: | , , |
Format: | Electronic eBook |
Language: | English |
Published: |
New York ; London :
Springer,
2008.
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Series: | Series on integrated circuits and systems.
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Subjects: |
Internet
Full Text (via Springer)Online
Call Number: |
TK7874 .W34 2008
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TK7874 .W34 2008 | Available |