A New Wafer-Level Packaging Technology for MEMS with Hermetic Micro-Environment. [electronic resource]
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Online Access |
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Corporate Author: | |
Format: | Government Document Electronic eBook |
Language: | English |
Published: |
Washington, D.C. : Oak Ridge, Tenn. :
United States. National Nuclear Security Administration ; distributed by the Office of Scientific and Technical Information, U.S. Department of Energy,
2011.
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Internet
Online AccessOnline
Call Number: |
E 1.99:sand2011-1083c
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E 1.99:sand2011-1083c | Available |