Electromigration in thin films and electronic devices [electronic resource] : materials and reliability / edited by Choong-Un Kim.

Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area. Part on...

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Bibliographic Details
Online Access: Full Text (via ScienceDirect)
Other Authors: Kim, Choong-Un
Format: Electronic eBook
Language:English
Published: Oxford : Woodhead Pub., 2011.
Series:Woodhead Publishing in materials.
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Call Number: TA418.9.T45 E54 2010eb
TA418.9.T45 E54 2010eb Available