Reliability, packaging, testing, and characterization of MOEMS/MEMS, nanodevices, and nanomaterials XIII : 3-4 February 2014, San Francisco, California, United States / Herbert R. Shea, Rajeshuni Ramesham, editors ; sponsored by SPIE ; cosponsored by Samsung Advanced Institute of Technology (Korea, Republic of) ; published by SPIE.

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Bibliographic Details
Online Access:	Full Text (via SPIE Digital Library)
Corporate Author:	SPIE (Society) (sponsoring body.)
Other Authors:	Shea, Herbert R. (Editor), Ramesham, Rajeshuni (Editor)
Format:	eBook
Language:	English
Published:	Bellingham, Washington : SPIE, [2014]
Series:	Proceedings of SPIE--the International Society for Optical Engineering ; v. 8975.
Subjects:	Microelectromechanical systems > Reliability > Congresses. Microelectromechanical systems > Testing > Congresses. Microelectronic packaging > Congresses.

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Holdings details from Online
Call Number:	TK7875 .R44 2014e
TK7875 .R44 2014e	Available